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FPC & FPCA
Production Information
Custom FPC & FPCA
TSI experienced and dedicated engineering and production team has developed advanced process technologies that continuously increase our manufacturing productivity in order to provide the highest qualities, real time business services and total FPC and FPCA solutions for our OEM customers. Our FPCA products for various applications including mobile phones, touch panels, digital cameras, flat displays, notebooks, Autotronics as well as medical instrument market segments.
FPC Assembly Capability
FPC Capability Overview
RFQ Photo Gallery
TSI experienced and dedicated engineering and production team has developed advanced process technologies that continuously increase our manufacturing productivity in order to provide the highest qualities, real time business services and total FPC and FPCA solutions for our OEM customers. Our FPCA products for various applications including mobile phones, touch panels, digital cameras, flat displays, notebooks, Autotronics as well as medical instrument market segments.
FPC Assembly Capability
- FPC Max Size：1000mm(L)*460mm(W)
- FPC Thickness：5mm(Max)
- Component Size :
- Chip: 01005+ - Connector: Connector: Pitch 0.2mm+ - IC: Lead Pitch 0.2mm+ - BGA: Ball Pitch 0.2mm+ - SMT Accurate : ±0.03mm
- Solder Print Accurate : ±0.05mm
- Mount Point：4.5KK/Day
FPC Capability Overview
| Material | Coverlay | AD TH min 15 μm |
| Double side CCL | Cu TH min 1/4 oz | |
| Non-halogens Coverlay | AD TH min 15 μm | |
| Non-halogens D/S CCL | Cu TH min 1/4 oz | |
| Stiffener board | FR4 | |
| Aluminum Alloy | ||
| Stainless Steel board | ||
| Stiffener film | PI type | PI 2～ 9 mil |
| AD 25 ～ 50μm | ||
| PET type | PET 3～ 10mil | |
| AD 25 ～ 50μm | ||
| Thermo sensitive adhesive | Heat-cured | 25 、35 、50μm |
| Pressure sensitive adhesive | Pressure sensitive | 50 ～130μm |
| D/S Patterning | Pattern | Pitch = 100μm |
| Partial Pattern | Pitch = 80μm | |
| Guide Hole Size | Guide Hole Size | ∮ 0.15 mm |
| ∮ 0.1 mm | ||
| ∮ 0.075 mm | ||
| PTH | Thickness of Copper Plating | 15 ± 5 μm |
| 10 ± 3 μm | ||
| 7.5±2.5μm | ||
| Heat-cured | Min Thickness | Min = 10μm |
| Min Hole Diameter | Min = 1.0mm | |
| Max Deviation | Max = ± 0.2mm | |
| Photo sensitive | Min Thickness | Min = 15μm |
| Min Hole Diameter | Min = 0.1mm | |
| Max Deviation | Max = ± 0.07mm | |
| Sn/Cu Plating | Thickness | 1 ～ 20 μm |
| Ni/Au Plating | Thickness | Ni = 1～ 6 μm |
| Flash Au/General | Au = 0.03 ～ 0.09μm / 0.2 ～ 0.9μm | |
| Immersion Ni/Au | Thickness | Ni = 2 ～6 μm |
| Au = 0.03 ～ 0.09 μm |
RFQ Photo Gallery
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